SEAKR Licenses Kandou Glasswing™ SerDes Technology for Chiplet-Based Aerospace Applications
SEAKR Licenses Kandou Glasswing™ SerDes Technology for Chiplet-Based Aerospace Applications Glasswing™ SerDes Enables Chiplet Integration in a Shared MCM Package Without Requiring an Interposer Email Print Friendly Share October 30, 2019 07:00 ET | Source: Kandou Bus LAUSANNE, Switzerland and CENNTENNIAL, Colo., Oct. 30, 2019 (GLOBE NEWSWIRE) — Kandou Bus announced today that their Glasswing™ chip-to-chip link technology has…